PROPERTIES & TECHNICAL OVERVIEW
PROPERTIES
Selective electrochemical metallization offers unique features that achieve the various physical, chemical, and elect rical propert ies required to achieve the desired results.
- EDense = no occlusions or weaknesses
- EPure = no impurity carried
- EControlled Structure = no stucco firing
- EFinished substrate mirror surfaces = less machining required
- EAtomic bond = integral recovery, excellent adhesion
TECHNICAL OVERVIEW
- EThe “brushing” action modifies the layers of hydrodynamic bonds at the surface causing a rapid solution movement
- EThe high speed of the solution restores metalions to the surface more quickly
- EHydrogen gas bubbles are removed by the brushing action and the high speed of the solution
- EThe “brushing” action integrates the deposit on the surface as it forms
- ESelective electrochemical metallization allows easy control of overlap application exactly where required on the part or equipment component