PROPERTIES & TECHNICAL OVERVIEW

PROPERTIES

Selective electrochemical metallization offers unique features that achieve the various physical, chemical, and elect rical propert ies required to achieve the desired results.

  • EDense = no occlusions or weaknesses
  • EPure = no impurity carried
  • EControlled Structure = no stucco firing
  • EFinished substrate mirror surfaces = less machining required
  • EAtomic bond = integral recovery, excellent adhesion

TECHNICAL OVERVIEW

  • EThe “brushing” action modifies the layers of hydrodynamic bonds at the surface causing a rapid solution movement
  • EThe high speed of the solution restores metalions to the surface more quickly
  • EHydrogen gas bubbles are removed by the brushing action and the high speed of the solution
  • EThe “brushing” action integrates the deposit on the surface as it forms
  • ESelective electrochemical metallization allows easy control of overlap application exactly where required on the part or equipment component
Three blue parts stacked-Kaytek